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current mode pwm controller ap384xc data sheet 1 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited general description the ap3842c/3c/4c/5c are high performance fixed frequency current-mode pwm controller series. these integrated circuits ar e optimized for off-line and dc-dc converter applications with minimum external components. they feature under-voltage lockout (uvlo) circuit with low start-up current, trimmed oscillator for precise duty cycle control, current sense comparator providing maximum current limiting and a totem pole output stage for increasing output current. in addition, these ics also feature accurate protection against over-temperature, over-current and maximal output power. the ap3842c and ap3844c have uvlo thresholds of 16v(on) and 10v(off); the corresponding thresh- olds for ap3843c and ap3845c are 8.4 v(on) and 7.6v(off). the ap3842c and ap3843c can operate approaching 100% duty cycle; ap3844c and ap3845c can operate from zero to 50% duty cycle. these ics are available in soic-8 and dip-8 pack- ages. features low start-up current: 50 a robust v ref line/load regulation low line regulation : 4mv low load regulation : 4mv high stability of reference voltage over a full temperature range: 0.2mv/ o c operating frequency up to 500khz high pwm frequency stability over a full tem- perature range: 2.5% high pwm frequency stability under a full sup- ply voltage range: 0.2% accurate over-temperature protection with hys- teresis uvlo with hysteresis applications off-line converter dc-dc converter voltage adapter crt monitor power supply desktop power supply dvd/stb power supply soic-8 dip-8 figure 1. package types of ap3842c/3c/4c/5c option 1 option 2
current mode pwm controller ap384xc data sheet 2 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 2. pin configuration of ap3842c/3c/4c/5c (top view) pin configuration pin description pin number pin name function 1 comp this pin is the error amplifier output and is made available for loop compensation. 2v fb the inverting input of the error amplifier. it is normally connected to the switching power supply output through a resistor divider. 3i sense a voltage proportional to inductor current is connected to this input. the pwm uses this information to terminate the output switch conduction. 4r t /c t the oscillator frequency and maximum output duty cycle are programmed by con- necting resistor r t to v ref and capacitor c t to ground. operation to 500 khz is possi- ble. 5 gnd the combined control circuitry and power ground. 6 output this output directly drives the gate of a power mosfet. peak currents up to 1.0 a are sourced and sunk by this pin. 7v cc the positive supply of the control ic. 8v ref this is the reference output. it provides charging current for capacitor c t through resistor r t . comp i sense v fb r t /c t v ref v cc gnd output 1 2 3 4 8 7 6 5 m package (soic-8) p package (dip-8) 1 2 3 4 8 7 6 5 comp i sense v fb r t /c t v ref v cc gnd output
current mode pwm controller ap384xc data sheet 3 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited functional block diagram figure 3. functional block diagram of ap3842c/3c/4c/5c v cc gnd r t /c t v fb i sense comp v ref output osc vref good logic over temp protect t internal bias 2r r s/r 5v ref uvlo 2.50v pwn latch current sense comparator error amp 34v 1v 7 5 4 2 1 3 8 6 s r note: toggle flip-flop used for 3844c/45c only (note)
current mode pwm controller ap384xc data sheet 4 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited package tempera- ture range part number marking id packing type lead free green lead free green soic-8 -40 to 85 o c ap3842/3/4/5cm-e1 ap3842/3/4/5cm-g1 3842/3/4/5cm-e1 3842/3/4/5cm-g1 tube ap3842/3/4/5cmtr-e1 ap3842/3/4/5cmtr-g1 3842/3/4/5cm-e1 3842/3/4/5cm-g1 tape & reel dip-8 ap3842/3/4/5cp-e1 ap3842/3/4/5cp-g1 ap3842/3/4/5cp-e1 ap3842/3/4/5cp-g1 tube circuit type package p: dip-8 m: soic-8 e1: lead free ap384xc - tr: tape and reel blank: tube ordering information g1: green bcd semiconductor's pb-free products, as designated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages. 2: ap3842c 3: ap3843c 4: ap3844c 5: ap3845c
current mode pwm controller ap384xc data sheet 5 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited parameter symbol value unit supply voltage v cc 30 v output current i o 1 a analog inputs v(ana) -0.3 to 6.3 v error amp output sink current i sink (e.a) 10 ma power dissipation at t a < 25 o c (dip-8) p d (note 3) 1000 mw power dissipation at t a <25 o c (soic-8) p d (note 3) 460 mw junction operating temperature t j -40 to 150 o c thermal resistance (junction to ambient) ja dip-8 140 o c/w soic-8 160 o c/w storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead +300 o c esd (machine model) 250 v note 1: stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those ind i- cated under "recommended operating conditions" is not implied. exposure to "absolute maximum ratings" for extended periods may affect device reliability. note 2: all voltages are with respect to pin 5 and all currents are positive into specified terminal. note 3: board thickness 1.6mm, board dimension 90mm x 90mm. parameter symbol min max unit oscillation frequency f 500 khz ambient temperature t a -40 85 o c recommended operating conditions absolute maximum ratings (note 1,
current mode pwm controller ap384xc data sheet 6 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited parameter symbol conditions min typ max unit reference section reference output voltage v ref t a =25 o c, i ref =1ma 4.90 5.00 5.10 v total output variation line, load, temp. 4.82 5.18 v line regulation v ref 12v v cc 25v 4 15 mv load regulation v ref 1ma i ref 20ma 4 15 mv short circuit output current i sc t a =25 o c -100 -180 ma temperature stability (note 6) 0.3 mv/ o c oscillator section oscillation frequency f t a =25 o c 47 52 57 khz oscillator amplitude v osc pin 4, peak to peak (note 6) 1.7 v temperature stability (note 6) 2.5 % voltage stability 12v v cc 25v 0.2 1 % discharge current vpin 4 =2v(note 7) 8.5 9.5 10.5 ma error amplifier section input voltage v i vpin 1=2.5v 2.45 2.50 2.55 v output sink current i sink vpin1=1.1v 5 8 ma output source current i source vpin1=5v -0.5 -0.8 ma high output voltage v oh rl=15k to gnd 5 7 v low output voltage v ol rl=15k to pin 8 0.7 1.1 v voltage gain 2v v o 4v 65 90 db power supply rejection ratio psrr 12v v cc 25v 60 70 db current sense section maximum input signal v i (max) vpin1=5v(note 4) 0.9 1 1.1 v gain gv (note 4, 5) 2.85 3 3.15 v/v power supply rejection ratio psrr 12v v cc 25v (note 4, 6) 70 db delay to output vpin3 = 0 to 2v (note 6) 150 300 ns input bias current i bias -3 -10 a output section low output voltage v ol i sink = 20ma 0.1 0.4 v i sink = 200ma 1.4 2.2 v high output voltage v oh i source = 20ma 13 14 v i source = 200ma 12 13 v rise time t r t a =25 o c, c l =1nf (note 6) 50 150 ns fall time t f t a =25 o c, c l =1nf (note 6) 50 150 ns (v cc =15v, r t =10k c t =3.3nf, t a =25 o c, unless otherwise specified.) electrical characteristics
current mode pwm controller ap384xc data sheet 7 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited electrical characteristics (continued) parameter symbol conditions min typ max unit under -voltage lockout section start threshold v th (st) ap3842c/ap3844c 15 16 17 v ap3843c/ap3845c 7.8 8.4 9.0 v min. operation voltage (after turn on) v opr (min.) ap3842c/ap3844c 8.5 10.0 11.5 v ap3843c/ap3845c 7.0 7.6 8.2 v pwm section max. duty cycle d(max.) ap3842c/ap3843c 95 97 100 % d(max.) ap3844c/ap3845c 46 48 50 % min. duty cycle d(min.) 0 % total standby current section start-up current i st ap3842c/ap3844c, v cc =14v 50 80 a ap3843c/ap3845c, v cc =6.5v 50 80 operating supply current i cc (opr) vpin3=vpin2=0v 8 12 ma zener voltage v z i cc =25ma 30 34 v over-temperature protect section shutdown temperature t shut (note 6) 155 o c temperature hysteresis t hys (note 6) 25 o c a= , 0 vpin3 0.8v vpin 3 note 5: here gain is defined as: vpin 1 note 6: these parameters, although guar anteed, are not 100% tested in production. note 7: this parameter is measured with rt=10k to v ref, it contributes 0.3ma of current to the measured value. so the total current flowing into the ct pin will be 0.3ma higher than the measured value approximately. note 4: parameters are tested at trip point of latch with vpin2 = 0. figure 4. basic test circuit 1 2 8 7 ap384xc 3 45 6 v ref v cc output gnd r t /c t i sense v fb comp v ref v cc output gnd 1k 1w c t 5k i sense adjust 1k error amp adjust 4.7k 100k 2n2222 4.7k r t 0.1 f 0.1 f a
current mode pwm controller ap384xc data sheet 8 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 4 is the basic test circuit for ap384xc. in testing, the high peak currents asso ciated with cap acitive loads necessitate careful grounding techniques. timing and bypa ss capacitors should be connected close to pin 5 in a single point ground. the transistor and 5k potentiometer are used to sample the oscillator waveform and apply an adjustable ramp to pin 3. figure 7. reference voltage vs. ambient temperature typical performance characteristics figure 5. oscillator dead time vs. timing capacitor figure 6. timing resistor vs. frequency electrical characteristics (continued) figure 8. output saturation characteristics -40-20 0 20406080100120 4.980 4.985 4.990 4.995 5.000 5.005 5.010 5.015 v cc =15v, i o =1ma reference voltage (v) ambient temperature ( o c) 0 50 100 150 200 250 300 350 400 450 500 550 600 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 v cc =15v, t a =25 o c saturation voltage (v) output sink current (ma)
current mode pwm controller ap384xc data sheet 9 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited typical performance characteristics (continued) figure 9. error amplifier open-loop frequency response figure 10. start-up current vs. ambient temperature 10 100 1k 10k 100k 1m 0 10 20 30 40 50 60 70 80 90 voltage gain (db) frequency (hz) v cc =15v, t a =25 o c 0 2 4 6 8 1012141618 0 10 20 30 40 50 60 70 80 ap3842c/44c start-up current ( a) supply voltage (v) ap3843c/45c figure 11. start-up current vs. supply voltage -40 -20 0 20 40 60 80 100 120 30 40 50 60 70 80 90 ap3843c/45c, v cc =6.5v start-up current ( a) ambient temperature ( o c) ap3842c/44c, v cc =14v
current mode pwm controller ap384xc data sheet 10 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 12. typical application of ap3842c/3c/4c/5c typical application + 8 4 6 3 + + j1 ac 90 to 265v bridge diode 1n4007*4 r2 1m/ 0.25w c14 100 /400v c2 0.01 600v r3 39k 2w d1 byv26e t d3 8tq100 l3 10 c9 2200 c10 1000 c11 1 r20 2k z2 sa12a j2 12v/5a c1 47 r4 10 d2 1n4001 u1 ap3842c/3c/4c/5c v cc 7 2 1 5 v cc v ref v fb r t /c t comp output gnd i sense u2 pc817 c5 220p r14 130k r13 15k r12 100 z1 1n5819 r7 1k r6 20 q1 irf830 r9 7.5k r10 0.51/1w c6 2200p/600v r5 10k c8 0.22 r15 100 r16 8.2k w1 1k r18 3.9k r17 2k u3 az431 ntc c3 0.1 c4 3.3n + r11 820 c7 680p c15 100p r19 10 c15 2.2n
current mode pwm controller ap384xc data sheet 11 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mechanical dimensions soic-8 unit: mm(inch) 0 8 1 7 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0. 039) 0.300(0.012) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0. 004) 0.300(0. 012) 0.900(0. 035) 3.800(0. 150) 4.000(0. 157) 7 7 2 0 : 1 d 1.270(0. 050) typ 0.150(0. 006) 0.250(0. 010) 8 d 5.800(0. 228) 6.200(0. 244) 0.675(0. 027) 0.725(0. 029) 0.320(0. 013) 8 0.450(0. 017) 0.800(0. 031) 4.700(0.185) note: eject hole , oriented hole and mold mark is optional . option 1 option 1 option 2 0.350(0.014) typ typ typ typ
current mode pwm controller ap384xc data sheet 12 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mechanical dimensions (continued) unit: mm(inch) dip-8 4 6 r0.750(0.030) 0.254(0.010)typ 0.130(0.005)min 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)typ 4 6 5 0.700(0.028) 9.000(0.354) 9.600(0.378) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 2.540(0.100) typ 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)min 3.000(0.118) depth 0.100(0.004) 0.200(0.008) 1.524(0.060) typ note: eject hole, oriented hole and mold mark is optional.
current mode pwm controller ap384xc data sheet 13 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mounting pad layout unit: mm(inch) soic-8 dimensions z (mm)/(inch) g (mm)/(inch) x (mm)/(inch) y (mm)/(inch) e (mm)/(inch) value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 grid placement courtyard zg y ex
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - 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wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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